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Process Integration Engineer at TSMC
Experienced Process Integration Engineer with a demonstrated history of working in the semiconductor industry. Currently involved in the startup of TSMC Arizona, my expertise covers all semiconductor manufacturing segments, including FEOL, BEOL and bumping processes. With deep experience in complex process integration, data analysis, product ramping and continuous yield improvement, I distinguish myself through inter-organizational communication, concise executive level summaries and delivering on commitments through aggressive milestones. I find immense joy in striving for TSMC's dedication in manufacturing excellence and customer trust. I add value to my organization not only through technical expertise, but also strong work ethic and dedication to solving challenging problems ahead.
University of Illinois Urbana-Champaign
Master's Degree, Materials Science & Engineering
January 1, 2013 – January 1, 2014
Illinois Institute of Technology
Bachelor of Science, Materials Science & Engineering
January 1, 2009 – January 1, 2013
Munich International School e.V.
International Baccalaureate (IB)
N/A – Present
TSMC
Principal Engineer, Process Integration
December 1, 2022 – Present
TSMC
Sr. Process Integration Engineer
January 1, 2018 – November 1, 2022
TSMC
Process Engineer (CoWoS Bumping - Advanced Packaging Dept.)
August 1, 2015 – December 1, 2017
Illinois Institute of Technology
Undergraduate Research Assistant
May 1, 2011 – July 1, 2013
Interprofessional Projects: Production Control Improvement
January 1, 2013 – May 1, 2013
Studying manufacturing production control issues at OMRON Automotive Electronics Inc., a Fortune 500 company with its North American headquarters in St. Charles, Illinois. Helping OMRON mitigate the risk of loss related to the movement of materials around the St. Charles plant.
Investigation of Fe-V-Sn, Fe-Co-In and Fe-Ni-In Systems Using Diffusion Multiples
May 1, 2011 – July 1, 2013
Search for compositions at which stable Heusler phases exist for various experimental ternary Heusler alloys • Use arc melter and Gleeble 3500 thermal testing system to form diffusion couples • Observe the liquid diffusion of the third element into the first two and gain valuable knowledge into the specific conditions (such as temperature and composition) required to bring about stable Heusler phases in these ternary alloys • Provide important data for establishing ternary phase diagrams for each respective system • Final work presented at 2013 MS&T Conference in Montreal
Engineer in Training (EIT)
NCEES
June 28, 2026 – Present
International Tutor Training Program Certification (ITTPC)
College Reading & Learning Association
June 28, 2026 – Present
Member - Illinois Beta Chapter
The Tau Beta Pi Association, Inc.
June 28, 2026 – Present
Cultural Fit Analysis
The candidate has a strong background in materials science and semiconductor manufacturing, with significant tenure at TSMC. While the experience is deep within a specific industry, the projects listed (e.g., 'Investigation of Fe-V-Sn, Fe-Co-In and Fe-Ni-In Systems Using Diffusion Multiples', 'Production Control Improvement') show an analytical and problem-solving mindset that could translate to a data analyst role. However, the direct alignment with a typical 'Data Analyst' role requiring broad business domain understanding or specific data analysis tools (SQL, Python, R, Tableau, etc.) is not explicitly demonstrated. The focus is heavily on manufacturing process data analysis rather than broader business intelligence or strategic data analysis.
Soft Skills & Operational Fit
The candidate's experience in customer relationship handling (technical consulting/complaint handling) and co-working with process engineers suggests good communication and collaboration skills. Managing daily production support and conducting experiments for cost reduction indicates a results-oriented and problem-solving approach. However, specific soft skills like leadership or project management are not explicitly detailed beyond role titles.