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Power Technical Lead at Intel
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Technical leader with over 20 years of experience in the semiconductor industry specializing in the design of server processors for high performance computing and ultra low power mobile chips for wireless applications. Working on the design of efficient and sustainable server products for cloud computing, AI and real-time analytics, using state of the art process technology.
Trinity College, University of Cambridge
M.Phil., Microelectronic Engineering and Semiconductor Physics
January 1, 1993 – January 1, 1994
University of Calcutta
B.Tech, Electronics Engineering
January 1, 1989 – January 1, 1993
Intel Corporation
Power Convergence Lead - Data Center and Artificial Intelligence Group
November 1, 2014 – Present
San Francisco Bay Area
LSI, an Avago Technologies Company
Principal Design Engineer
January 1, 2012 – January 1, 2014
San Francisco Bay Area
Broadcom
Physical Design Consultant
January 1, 2010 – January 1, 2011
San Francisco Bay Area
Tabula
Senior Staff Engineer
January 1, 2007 – January 1, 2009
San Francisco Bay Area
NextWave Broadband
Staff Design Engineer
January 1, 2006 – January 1, 2007
San Diego County, California, United States
ATI Technologies
Senior Design Engineer
January 1, 1999 – January 1, 2006
San Francisco Bay Area
Interra Inc.
Senior Member of Technical Staff
January 1, 1997 – January 1, 1999
San Francisco Bay Area
Cultural Fit Analysis
The candidate has a long and distinguished career in semiconductor design, working for major industry players like Intel, Broadcom, and ATI. Their experience spans various product types (CPUs, GPUs, SSD controllers, NNPs, programmable chips) and process nodes, indicating adaptability and a broad understanding of the industry. The role as 'Power Convergence Lead' and 'Physical Design and Integration Lead' at Intel, along with leading physical design activities at Tabula and NextWave Broadband, suggests a strong leadership and collaborative mindset. The target role of 'FPGA Developer' aligns with their background in programmable chips and physical design, although direct FPGA development experience is not explicitly detailed in the resume.
Soft Skills & Operational Fit
The candidate's experience at Intel, LSI, Broadcom, Tabula, NextWave Broadband, ATI Technologies, and Interra Inc. demonstrates a strong track record in leading technical teams, collaborating with cross-functional groups, and engaging with EDA tool vendors. This indicates strong operational fit and leadership capabilities. The descriptions highlight problem-solving, methodology development, and project leadership, which are critical for senior roles.