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Semiconductor Technologist | Device Design Engineer at Intel
I am a semiconductor professional with working knowledge and years of experience in areas spanning from semiconductor front-end to far backend processes. My interest lies in applying machine/deep/reinforcement/physics-informed learning techniques to tackle engineering problems. Core skills: machine learning, data mining, predictive modeling, semiconductors, nonvolatile memory, device physics, advanced packaging, metrology, reliability, electronics, industry R&D, manufacturing, nanotechnology.
Georgia Institute of Technology
M.S., Computer Science
January 1, 2017 – January 1, 2021
The University of Texas at Austin
Ph.D., Electrical and Computer Engineering
January 1, 2009 – January 1, 2015
The University of Texas at Austin
M.S.E., Electrical and Computer Engineering
January 1, 2009 – January 1, 2011
Fudan University
B.S., Microelectronics
January 1, 2005 – January 1, 2009
Intel Corporation
Device Design Engineer
May 1, 2025 – Present
Chandler, Arizona, United States
Sandisk
Principal Device Engineer
May 1, 2022 – May 1, 2025
Milpitas, California, United States
Intel Corporation
Group Lead / Engineering Manager
October 1, 2021 – May 1, 2022
Chandler, Arizona, United States
Intel Corporation
Staff Packaging R&D Engineer
September 1, 2015 – May 1, 2022
Chandler, Arizona, United States
Micron Technology
Device Engineer Intern (CMOS FET)
May 1, 2014 – August 1, 2014
Boise, Idaho, United States
Microelectronics Research Center, The University of Texas at Austin
Graduate Research Assistant
May 1, 2010 – August 1, 2015
Austin, Texas, United States
Microelectronics Research Center, The University of Texas at Austin
Teaching Assistant
August 1, 2009 – May 1, 2010
Austin, Texas, United States
Cultural Fit Analysis
The candidate's background is heavily rooted in semiconductor R&D and device engineering. While there's exposure to machine learning and predictive modeling, the overall experience is highly specialized. The target role of 'Data Analyst' represents a significant shift from their core domain. The lack of diverse project experience outside of semiconductor R&D might indicate a need for adaptation to broader data analysis contexts. The extensive academic background and long tenure at major tech companies suggest a stable and research-oriented work ethic.
Soft Skills & Operational Fit
The candidate's resume indicates experience in group leadership and principal engineering roles, suggesting strong analytical and communication skills. The descriptions of R&D activities involving predictive modeling and machine learning imply a problem-solving mindset and adaptability. However, specific examples of collaboration or stress handling are not detailed.