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Back-end and Packaging Development Sr manager at STMicroelectronics
Senior Package Development Manager with 35+ years in microelectronics packaging, back-end operations, and innovation. Expert in leading New Product Introduction (NPI) and delivering advanced packaging solutions for automotive, industrial, and mobile markets both for digital and analog applications. Experienced in translating complex technologies into clear value propositions by working closely with marketing and sales teams. Proven ability to present packaging roadmaps and benefits to customers and stakeholders, aligning with business goals. Strong technical background in GaN, advanced silicon, MOS devices, 2.5D/3D packaging, and silicon photonics, with extensive skills in process qualification, supplier management, and cross-functional leadership. Passionate about innovation and customer-focused product development, thriving at the intersection of technology and market needs.
STMicroelectronics
Central Eng. PROJ MGR
January 1, 2025 – Present
STMicroelectronics
Silicon Photonics Backend Sr Staff Engg.
June 1, 2007 – Present
Pirelli Labs Optical Innovation
Senior Process Eng.
June 1, 2001 – August 1, 2007
Milan, Lombardy, Italy
Alcatel
Process Eng, MW package design
November 1, 1986 – June 1, 2001
Vimercate (MB)
Cultural Fit Analysis
The candidate has a long and stable career history with significant tenure at STMicroelectronics and Pirelli Labs. Their experience is primarily in highly specialized engineering and management roles within the semiconductor industry. While this demonstrates commitment and deep domain expertise, the lack of diverse project experience or explicit collaboration details makes it difficult to fully assess cultural fit for a general 'Software Engineer' role without further information.
Soft Skills & Operational Fit
The provided data does not contain sufficient information to assess soft skills or operational fit. The candidate's experience is heavily focused on technical and managerial roles in semiconductor manufacturing.